8/2/2023 0 Comments Spacechem sernimir iWith burn-in testing, we stress the device, accelerating these dormant faults to manifest as failures. These faults are dormant and randomly manifest into device failures during device life-cycle. The root cause of fails detected during burn-in testing can be identified as dielectric failures, conductor failures, metallization failures, electromigration, mouse-bites, etc. Traditional stuck-at testing does not detect these types of faults because they may be dormant and need to be stressed to manifest as “fails” (during burn-in).
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